Plasma modelling using quantum computing
Problem
EUV Lithography machines have fundamental plasma challenges that reduce the quality of the machine’s performance and can even form a limit on how many high-quality chips can be produced worldwide.
Solution
ASML and TNO collaborate to explore how quantum computing solutions can improve the understanding of the EUV challenges and ameliorate their impact on lithography machines.
Benefit
By using quantum algorithms to improve the simulation of plasma physics inside machines, we can contribute to more durable machines, and better wafer yields.
